Omniprobe Lift-Out Grids提升式网格
 

The Omniprobe^® Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems. Typical thickness of the grids is 25-30µm with a diameter of 3mm. The posts are designed for optimum access and provide a secure area for attaching （welding） the lamella（s）. The Omniprobe grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts.
Available in standard Cu with 3, 4 and 5 posts and in Mo With 3 and 4 posts. All Lift-Out Grids have multiple indexed mounting positions for easy identification and positioning in the TEM.